China’s semiconductor industry has reportedly reached a major milestone with the development of its first domestic extreme ultraviolet (EUV) lithography prototype. EUV technology is used to make the world’s most advanced chips and has so far been mastered only by Dutch firm ASML. For years, the US has tried to block China’s access to this technology, making the reported breakthrough significant.
According to reports, Chinese companies including Semiconductor Manufacturing International Corporation have been working to replicate EUV systems, partly by studying older ASML components. Reuters reported that China has now built an EUV prototype, going further than experts expected. Earlier this year, ASML CEO Christophe Fouquet said China would need many years to achieve this level of technology.
EUV machines work by firing a powerful laser at tiny droplets of molten tin to produce ultraviolet light, which is then used to etch extremely fine circuits onto silicon wafers. ASML spent more than €6 billion over 17 years developing this technology. While China is not yet producing EUV-made chips, reports say it aims to make the technology operational by 2030.
The development comes as the US and China race to strengthen their chip industries amid the AI boom. In China, Huawei is expanding semiconductor facilities with SMIC, while the US continues to invest heavily under the CHIPS and Science Act.
Author: Saikat Bhattacharya
